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PD - 94210 IRHQ597110 RADIATION HARDENED POWER MOSFET SURFACE MOUNT (LCC-28) Product Summary Part Number Radiation Level IRHQ597110 100K Rads (Si) IRHQ593110 300K Rads (Si) RDS(on) 0.96 0.98 ID -2.8A -2.8A 100V, Quad P-CHANNEL RAD-Hard HEXFET TM (R) 4# TECHNOLOGY LCC-28 International Rectifier's RAD-HardTM HEXFET(R) MOSFET Technology provides high performance power MOSFETs for space applications. This technology has over a decade of proven performance and reliability in satellite applications. These devices have been characterized for both Total Dose and Single Event Effects (SEE). The combination of low RDS(on) and low gate charge reduces the power losses in switching applications such as DC to DC converters and motor control. These devices retain all of the well established advantages of MOSFETs such as voltage control, fast switching, ease of paralleling and temperature stability of electrical parameters. Features: n n n n n n n n n n Single Event Effect (SEE) Hardened Low RDS(on) Low Total Gate Charge Proton Tolerant Simple Drive Requirements Ease of Paralleling Hermetically Sealed Ceramic Package Surface Mount Light Weight Absolute Maximum Ratings ( Per Die) Parameter ID @ VGS = -12V, TC = 25C ID @ VGS = -12V, TC = 100C IDM PD @ TC = 25C VGS EAS IAR EAR dv/dt TJ T STG Continuous Drain Current Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Pckg. Mounting Surface Temp. Weight For footnotes refer to the last page -2.8 -1.8 -11.2 12 0.1 20 70 -2.8 1.2 7.1 -55 to 150 300 (for 5s) 0.89 (Typical) Pre-Irradiation Units A W W/C V mJ A mJ V/ns o C g www.irf.com 1 5/03/01 IRHQ597110 Pre-Irradiation Electrical Characteristics @ Tj = 25C (Unless Otherwise Specified) ( Per Die) Parameter Min Typ Max Units -- -0.13 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 6.1 -- -- 1.2 0.96 -4.0 -- -10 -25 -100 100 11 3.0 4.2 20 24 32 90 -- V V/C V S( ) A Test Conditions VGS = 0V, ID = -1.0mA Reference to 25C, ID = -1.0mA VGS = -12V, ID = -2.8A VGS = -12V, ID = -1.8A VDS = VGS, ID = -1.0mA VDS > -15V, IDS = -1.8A VDS= -80V, VGS=0V VDS = -80V, VGS = 0V, TJ = 125C VGS = -20V VGS = 20V VGS = -12V, ID = -2.8A VDS = -50V VDD = -50V, ID = -2.8A, VGS = -12V, RG = 7.5 BVDSS Drain-to-Source Breakdown Voltage -100 BV DSS/T J Temperature Coefficient of Breakdown -- Voltage RDS(on) Static Drain-to-Source On-State -- Resistance -- VGS(th) Gate Threshold Voltage -2.0 gfs Forward Transconductance 1.9 IDSS Zero Gate Voltage Drain Current -- -- IGSS IGSS Qg Q gs Q gd td(on) tr td(off) tf LS + LD Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (`Miller') Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Inductance -- -- -- -- -- -- -- -- -- -- nA nC ns nH Measured from the center of drain pad to center of source pad VGS = 0V, VDS = -25V f = 1.0MHz Ciss C oss C rss Input Capacitance Output Capacitance Reverse Transfer Capacitance -- -- -- 377 102 7.0 -- -- -- pF Source-Drain Diode Ratings and Characteristics (Per Die) Parameter IS ISM VSD t rr Q RR ton Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time Min Typ Max Units -- -- -- -- -- -- -- -- -- -- -2.8 -11.2 -5.0 138 555 Test Conditions A V nS nC Tj = 25C, IS = -2.8A, VGS = 0V Tj = 25C, IF = -2.8A, di/dt 100A/s VDD -50V Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD. Thermal Resistance (Per Die) Parameter R thJC RthJA Junction-to-Case Junction-to-Ambient Min Typ Max Units -- -- -- -- 11.8 60 C/W Test Conditions Typical socket mount For footnotes refer to the last page 2 www.irf.com Pre-Irradiation IRHQ597110 International Rectifier Radiation Hardened MOSFETs are tested to verify their radiation hardness capability. The hardness assurance program at International Rectifier is comprised of two radiation environments. Every manufacturing lot is tested for total ionizing dose (per notes 5 and 6) using the TO-3 package. Both pre- and post-irradiation performance are tested and specified using the same drive circuitry and test conditions in order to provide a direct comparison. Table 1. Electrical Characteristics @ Tj = 25C, Post Total Dose Irradiation (Per Die) Parameter BVDSS V GS(th) IGSS IGSS IDSS RDS(on) RDS(on) VSD Drain-to-Source Breakdown Voltage Gate Threshold Voltage Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Zero Gate Voltage Drain Current Static Drain-to-Source On-State Resistance (TO-39) Static Drain-to-Source On-State Resistance (LCC-28) Diode Forward Voltage 100K Rads(Si)1 Min Max -100 - 2.0 -- -- -- -- -- -- -- -4.0 -100 100 -10 0.916 0.96 -5.0 300K Rads (Si)2 Min Max -100 - 2.0 -- -- -- -- -- -- -- -5.0 -100 100 -10 0.936 0.98 -5.0 Units V nA A V Test Conditions VGS = 0V, ID = -1.0mA VGS = VDS, ID = -1.0mA VGS = -20V VGS = 20 V VDS= -80V, VGS =0V VGS = -12V, ID = -1.8A VGS = -12V, ID = -1.8A VGS = 0V, IS = -2.8A 1. Part number IRHQ597110 2. Part number IRHQ593110 International Rectifier radiation hardened MOSFETs have been characterized in heavy ion environment for Single Event Effects (SEE). Single Event Effects characterization is illustrated in Fig. a and Table 2. Table 2. Single Event Effect Safe Operating Area (Per Die) Ion Cu Br I LET MeV/(mg/cm2)) 28.0 36.8 59.8 Energy (MeV) 285 305 343 Range (m) @VGS=0V @VGS=5V 43.0 -100 -100 39.0 -100 -100 32.6 -60 -- VDS (V) @VGS=10V -100 -70 -- @VGS=15V -70 - 50 -- @VGS=20V -60 -40 -- -120 -100 -80 VDS -60 -40 -20 0 0 5 10 VGS 15 20 Cu Br I Fig a. Single Event Effect, Safe Operating Area For footnotes refer to the last page www.irf.com 3 IRHQ597110 Pre-Irradiation 100 -I D , Drain-to-Source Current (A) -I D , Drain-to-Source Current (A) 10 VGS -15V -12V -10V -9.0V -8.0V -7.0V -6.0V BOTTOM -5.0V TOP 100 10 VGS -15V -12V -10V -9.0V -8.0V -7.0V -6.0V BOTTOM -5.0V TOP -5.0V -5.0V 1 1 0.1 0.1 20s PULSE WIDTH T = 25 C J 1 10 100 0.1 0.1 20s PULSE WIDTH T = 150 C J 1 10 100 -VDS , Drain-to-Source Voltage (V) -VDS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 100 2.5 R DS(on) , Drain-to-Source On Resistance (Normalized) ID = -2.8A -I D , Drain-to-Source Current (A) 2.0 TJ = 25 C 10 1.5 TJ = 150 C 1.0 0.5 1 5.0 V DS = -50V 20s PULSE WIDTH 8.0 9.0 6.0 7.0 10.0 0.0 -60 -40 -20 VGS = -12V 0 20 40 60 80 100 120 140 160 -VGS , Gate-to-Source Voltage (V) TJ , Junction Temperature( C) Fig 3. Typical Transfer Characteristics Fig 4. Normalized On-Resistance Vs. Temperature 4 www.irf.com Pre-Irradiation IRHQ597110 600 500 -VGS , Gate-to-Source Voltage (V) VGS Ciss Crss Coss = = = = 0V, f = 1MHz Cgs + Cgd , Cds SHORTED Cgd Cds + Cgd 20 ID = -2.8A 16 C, Capacitance (pF) VDS = -80V VDS = -50V VDS = -20V 400 C iss 12 300 8 200 C oss 4 100 C rss 0 1 10 100 0 0 2 4 FOR TEST CIRCUIT SEE FIGURE 13 8 10 6 12 -VDS , Drain-to-Source Voltage (V) Q G , Total Gate Charge (nC) Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage 100 100 OPERATION IN THIS AREA LIMITED BY R DS(on) 10 -ISD , Reverse Drain Current (A) 10 TJ = 150 C TJ = 25 C -I D, Drain-to-Source Current (A) 1 1 Tc = 25C Tj = 150C Single Pulse 0.1 1 10 100 1ms 10ms 0.1 1.0 V GS = 0 V 2.0 3.0 4.0 5.0 6.0 -VSD ,Source-to-Drain Voltage (V) 1000 -VDS , Drain-toSource Voltage (V) Fig 7. Typical Source-Drain Diode Forward Voltage Fig 8. Maximum Safe Operating Area www.irf.com 5 IRHQ597110 Pre-Irradiation 3.0 V DS VGS RG RD 2.5 D.U.T. + -ID , Drain Current (A) 2.0 VGS 1.5 Pulse Width 1 s Duty Factor 0.1 % 1.0 Fig 10a. Switching Time Test Circuit td(on) tr t d(off) tf 0.5 VGS 0.0 25 50 75 100 125 150 10% TC , Case Temperature ( C) 90% Fig 9. Maximum Drain Current Vs. Case Temperature VDS Fig 10b. Switching Time Waveforms 100 Thermal Response (Z thJA ) D = 0.50 0.20 10 0.10 0.05 0.02 1 0.01 SINGLE PULSE (THERMAL RESPONSE) 0.1 0.00001 0.0001 0.001 0.01 0.1 Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = P DM x Z thJA + TA 1 10 100 P DM t1 t2 t1 , Rectangular Pulse Duration (sec) Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 6 www.irf.com - V DD Pre-Irradiation IRHQ597110 VDS L 150 EAS , Single Pulse Avalanche Energy (mJ) RG D .U .T. IA S VD D A D R IV E R 120 VGS -20V tp ID -1.3A -1.8A BOTTOM -2.8A TOP 0.0 1 90 15V 60 Fig 12a. Unclamped Inductive Test Circuit 30 0 25 50 75 100 125 150 IAS Starting TJ , Junction Temperature ( C) Fig 12c. Maximum Avalanche Energy Vs. Drain Current tp V (BR)DSS Fig 12b. Unclamped Inductive Waveforms Current Regulator Same Type as D.U.T. 50K QG -12V 12V .2F .3F -12V QGS VG QGD VGS -3mA Charge IG ID Current Sampling Resistors Fig 13a. Basic Gate Charge Waveform Fig 13b. Gate Charge Test Circuit www.irf.com + D.U.T. - VDS 7 IRHQ597110 Pre-Irradiation Footnotes: Repetitive Rating; Pulse width limited by maximum junction temperature. VDD = - 25V, starting TJ = 25C, L= 17.8mH, Peak IL = - 2.8A, VGS =-12V ISD - 2.8A, di/dt - 263A/s, VDD -100V, TJ 150C Pulse width 300 s; Duty Cycle 2% Total Dose Irradiation with VGS Bias. -12 volt VGS applied and VDS = 0 during irradiation per MIL-STD-750, method 1019, condition A Total Dose Irradiation with VDS Bias. -80 volt VDS applied and VGS = 0 during irradiation per MlL-STD-750, method 1019, condition A Case Outline and Dimensions -- LCC-28 Q2 Q1 Q3 Q4 Q3 Q4 Q2 Q1 IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. Data and specifications subject to change without notice. 05/01 8 www.irf.com |
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